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	<title>Military Embedded Systems</title>
	<atom:link href="http://mil-embedded.opensystems.me/feed" rel="self" type="application/rss+xml" />
	<link>http://mil-embedded.opensystems.me</link>
	<description>Just another OpenSystems Media weblog</description>
	<lastBuildDate>Tue, 21 Feb 2012 15:00:00 +0000</lastBuildDate>
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		<title>White Paper: Enabling High-Speed Data Rates in Connectors for Aerospace and Defense Applications</title>
		<link>http://www.mil-embedded.com/articles/id/?5552</link>
		<comments>http://www.mil-embedded.com/articles/id/?5552#comments</comments>
		<pubDate>Tue, 21 Feb 2012 15:00:00 +0000</pubDate>
		<dc:creator>Matthew McAlonis, TE Connectivity</dc:creator>
				<category><![CDATA[White paper]]></category>
		<category><![CDATA[Aerospace]]></category>
		<category><![CDATA[connectivity]]></category>
		<category><![CDATA[Connectors]]></category>
		<category><![CDATA[defense]]></category>
		<category><![CDATA[electronic circuits]]></category>
		<category><![CDATA[high speed connector]]></category>
		<category><![CDATA[high speed ruggedized]]></category>
		<category><![CDATA[high-speed Fortis]]></category>
		<category><![CDATA[hsr]]></category>
		<category><![CDATA[interconnect industry]]></category>
		<category><![CDATA[mil spec]]></category>
		<category><![CDATA[military]]></category>
		<category><![CDATA[rugged power]]></category>
		<category><![CDATA[ruggedness]]></category>
		<category><![CDATA[Shock]]></category>
		<category><![CDATA[te]]></category>
		<category><![CDATA[TE Connectivity]]></category>
		<category><![CDATA[tyco]]></category>

		<guid isPermaLink="false">MES5552</guid>
		<description><![CDATA[A new high-speed connector system for aerospace and defense applications builds on  industry-proven technology to achieve new levels of ruggedness. By combining the designs of cutting-edge  high-speed  connectors with proven MIL - SPEC contacts, the new Fortis Zd connector meets  the demands of  emerging military applications by enabling data rates of 10 Gb/s+ while performing in  military-level vibration and shock  conditions.]]></description>
			<content:encoded><![CDATA[<div id='story' class='body'>
<div class='body-text'><img alt="1" class="figure_intro" src="http://i.opensystemsmedia.com/?zc=1&#038;f=png&#038;h=200&#038;w=225&#038;src=http%3A%2F%2Fattachments.opensystemsmedia.com%2FMES5552%2Ffigures%2F1" />High speed is a relative term used within the interconnect industry. High-speed electronic circuits must respond to fast input signals. A measure of the ability of a circuit to respond to fast  input signals is known as an edge rate or rise time. When this time is 500 picoseconds or less, a high-speed <a href="http://channels.opensystemsmedia.com/Connectors">connector</a> is required. The progressive advancements in electronic technology drive the data rate of the signals which pass through <a href="http://channels.opensystemsmedia.com/Connectors">connectors</a> and have been steadily increasing. To function properly in systems operating at higher speeds, the connectors and the layouts of the connector footprints on the circuit boards must  be carefully designed with specific emphasis on the high-speed electrical performance. Ideally the connector should be &#34;invisible&#34; in the system; hence, the integrity of the electrical signal as it passes through the interconnect and the interconnect footprint must be maintained.</p>
<p>
Connectors that have been designed in this manner are often referred to as high-speed connectors. Read this white paper to learn how TE Connectivity provided its customers connectors that support their data rate requirements.</div>
</p></div>
</p><div class="keywords"><h2>Topics covered in this article</h2><ul><li><a href="http://channels.opensystemsmedia.com/Connectors">Connectors</a></li><li><a href="http://channels.opensystemsmedia.com/Connectors">connector</a></li></ul></div>]]></content:encoded>
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		</item>
		<item>
		<title>Fairchild Semiconductor</title>
		<link>http://channels.opensystemsmedia.com/Fairchild%20Semiconductor</link>
		<comments>http://channels.opensystemsmedia.com/Fairchild%20Semiconductor#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>Fairchild Semiconductor</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[fairchild semiconductor]]></category>

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       			]]></description>
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<p></strong>
       			</div>
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		</item>
		<item>
		<title>TE Connectivity</title>
		<link>http://channels.opensystemsmedia.com/TE%20Connectivity</link>
		<comments>http://channels.opensystemsmedia.com/TE%20Connectivity#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>TE Connectivity</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[TE Connectivity]]></category>

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            List TE Connectivity Products
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       			]]></description>
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</ul>
<p></strong>
       			</div>
]]></content:encoded>
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		</item>
		<item>
		<title>Silicon Laboratories Inc.</title>
		<link>http://channels.opensystemsmedia.com/Silicon%20Laboratories%20Inc.</link>
		<comments>http://channels.opensystemsmedia.com/Silicon%20Laboratories%20Inc.#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>Silicon Laboratories Inc.</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[Silicon Laboratories Inc.]]></category>

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            List Silicon Laboratories Inc. Products
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       	Company Code:  SLAB		]]></description>
			<content:encoded><![CDATA[<div id="story"><span id="more-268814"></span>        <strong>
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</ul>
<p></strong></p>
<div style="font-size:10px; color:#999; letter-spacing:1px;"><b>Company Code:</b>  SLAB</div>
</p></div>
]]></content:encoded>
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		</item>
		<item>
		<title>PTC</title>
		<link>http://channels.opensystemsmedia.com/PTC</link>
		<comments>http://channels.opensystemsmedia.com/PTC#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>PTC</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[ptc]]></category>

		<guid isPermaLink="false">http://channels.opensystemsmedia.com/PTC</guid>
		<description><![CDATA[The Integrity Business Unit of PTC has been enabling organizationsindustrialize software engineering and achievecontinuous innovation since 1984. Our customers are able totame the complexity of today&#237;s complex and critical software,reducing cy...]]></description>
			<content:encoded><![CDATA[<div id="story">The Integrity Business Unit of PTC has been enabling organizations<br />
industrialize software engineering and achieve<br />
continuous innovation since 1984.<span id="more-268806"></span> Our customers are able to<br />
tame the complexity of today&#237;s complex and critical software,<br />
reducing cycle times and mitigating risk at every stage of<br />
development. Our software engineering platform, Integrity, is<br />
the only unified platform that offers the depth and breadth of<br />
capability to deliver collaboration and control over all development<br />
assets and activities. Our rapidly deployable solutions<br />
scale from 10 to 10,000 users across one or many roles, they<br />
integrate easily with adjacent and legacy systems, and they<br />
are repeatedly proven in successful deployments by demanding<br />
global enterprises.</p>
<p>Our solution, tailored to the unique needs of medical devices<br />
organizations, have been proven in successful implementations<br />
by leading <a href="http://tech.opensystemsmedia.com/telehealth/#medical%20device">medical device</a> manufacturers worldwide.        <strong>
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</ul>
<p></strong></p>
<div style="font-size:10px; color:#999; letter-spacing:1px;"><b>Company Code:</b>  MKSA</div>
</p></div>
</p><div class="keywords"><h2>Topics covered in this article</h2><ul><li><a href="http://tech.opensystemsmedia.com/telehealth/#medical%20device">medical device</a></li></ul></div>]]></content:encoded>
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		<item>
		<title>NXP</title>
		<link>http://channels.opensystemsmedia.com/NXP</link>
		<comments>http://channels.opensystemsmedia.com/NXP#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>NXP</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[NXP]]></category>

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       	Company Code:  NXP		]]></description>
			<content:encoded><![CDATA[<div id="story"><span id="more-268336"></span>        <strong>
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<p></strong></p>
<div style="font-size:10px; color:#999; letter-spacing:1px;"><b>Company Code:</b>  NXP</div>
</p></div>
]]></content:encoded>
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		<item>
		<title>Fortinet</title>
		<link>http://channels.opensystemsmedia.com/Fortinet</link>
		<comments>http://channels.opensystemsmedia.com/Fortinet#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>Fortinet</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[fortinet]]></category>

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		<title>Netronome</title>
		<link>http://channels.opensystemsmedia.com/Netronome</link>
		<comments>http://channels.opensystemsmedia.com/Netronome#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>Netronome</dc:creator>
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		<title>Red Bend Software</title>
		<link>http://channels.opensystemsmedia.com/Red%20Bend%20Software</link>
		<comments>http://channels.opensystemsmedia.com/Red%20Bend%20Software#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>Red Bend Software</dc:creator>
				<category><![CDATA[Vendors]]></category>
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		<title>Ethernet Direct Corporation</title>
		<link>http://channels.opensystemsmedia.com/Ethernet%20Direct%20Corporation</link>
		<comments>http://channels.opensystemsmedia.com/Ethernet%20Direct%20Corporation#comments</comments>
		<pubDate>Thu, 09 Feb 2012 19:00:00 +0000</pubDate>
		<dc:creator>Ethernet Direct Corporation</dc:creator>
				<category><![CDATA[Vendors]]></category>
		<category><![CDATA[Ethernet Direct Corporation]]></category>

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       	Company Code:  EDIR		]]></description>
			<content:encoded><![CDATA[<div id="story"><span id="more-266256"></span>        <strong>
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<div style="font-size:10px; color:#999; letter-spacing:1px;"><b>Company Code:</b>  EDIR</div>
</p></div>
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